Introduction to semiconductor plasma dicing with Ducoya
An inside look at our engineering experise
How Ducoya G001 UP Polymers Can Optimise the Plasma Dicing Process in Semiconductor Manufacturing
Plasma dicing is rapidly becoming the preferred method for dicing semiconductor wafers due its ability to work within very fine dicing lanes. It avoids many risks associated with mechanical damage caused by traditional cutting and cleaning techniques and the thermal stresses inherent in laser dicing. At Duvelco, we proudly offer Ducoya, a high-performance polyimide manufactured in the UK specifically designed to enhance the plasma dicing process.
This article aims to provide semiconductor industry engineers with a comprehensive understanding of how Ducoya G001 UP can benefit their dicing processes.
Why Choose Ducoya G001 UP for Plasma Dicing?
High purity and low particle generation
An additional feature of Ducoya is that it has both high purity and low particle generation. This means the small amount of material that can be lost to plasma erosion leaves the surface as a gas, which the vacuum evacuates. This low particle generation combined with high purity minimises the wafer's contamination risk. Compared to ceramics, Ducoya typically offers significantly reduced levels of metallic and other impurities.
Exceptional heat resistance
Plasma dicing does not cause localised heating and related thermally induced stresses. However, exposure to plasma can cause elevated temperatures, which are typically uniform over the wafer surface. Associated chamber furniture, such as precision vacuum mounting beds, must remain dimensionally stable, not degrade, and not have a coefficient of thermal expansion that is too different from the wafer material to ensure the vacuum on small components remains well placed at all experienced temperatures.
One of the primary advantages of Ducoya polyimide is its exceptional stability and consistency over an extensive temperature range from near absolute zero for cryogenic operations to 400°C (750°F) continuous exposure in a vacuum or other favourable chemical environment. Plasma dicing chambers typically experience no more than 200°C (392°F). Ducoya G series does not exhibit a glass transition temperature (Tg), so any thermal expansion is consistent. The high level of crystallinity within the Ducoya G series also means that thermal expansion is low.
Excellent plasma resistance and broad chemical resistance
Another significant benefit of Ducoya is its plasma resistance. This feature, coupled with broad chemical resistance, means Ducoya parts in the plasma chamber can deliver a long life even though the gases used in plasma dicing are intended to be highly reactive and are not compatible with many plastics.
Precision and miniaturisation
As the semiconductor industry moves towards producing smaller and more powerful devices installed in an increasing diversity of applications, the need for precise and clean dicing becomes increasingly important, especially for small MEMS chips and small components in general.
Ducoya is easily machined to micron levels of accuracy, thanks to its dimensional stability and inherent lubricity, which removes the need to cut with fluids. This means precision vacuum beds can securely accommodate tiny discrete dies. This combination of plasma cutting with Ducoya polyimide enables finer dicing lines, giving the critical advantage of a more significant number of equal-sized components per wafer, while omitting the time-consuming and hazardous, in terms of potential damage or contamination, manual step of tape mounting the wafer.
Elongation and elasticity
As a novel sealing material, Ducoya exhibits exceptional elongation and good elastic recovery without being prone to creep, even at elevated temperatures. However, Ducoya is not an elastomer, and sealing glands need to be designed to accommodate its nature as a plastic.
